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RE46C165/6/7/8
CMOS Photoelectric Smoke Detector ASIC with Interconnect, Timer Mode and Alarm Memory
Features
* Temporal Horn Pattern or Continuous Tone * Alarm Memory * Sensitivity Control Times: - 9 minutes (RE46C165/6) - 1.2 minutes (RE46C167/8) * I/O Filter and Charge Dump * Interconnect up to 40 Detectors * Internal Power-on Reset * >2000V ESD Protection (HBM) on All Pins * Low Quiescent Current Consumption (<8 A) * Internal Low Battery Detection and Chamber Test * RoHS Compliant Lead-Free Packaging
Description
The RE46C165/6/7/8 devices are low-power, CMOS photoelectric type, smoke detector ICs. With minimal external components, these circuits will provide all the required features for a photoelectric type smoke detector. Each design incorporates a gain selectable photo amplifier for use with an infrared emitter/detector pair. An internal oscillator strobes power to the smoke detection circuitry for 100 s every 10 seconds to keep standby current to a minimum. If smoke is sensed, the detection rate is increased to verify an alarm condition. A high gain mode is available for push button chamber testing. A check for a low battery condition and chamber integrity is performed every 43 seconds when in standby. The temporal horn pattern supports the NFPA 72 emergency evacuation signal. An interconnect pin allows multiple detectors to be connected so when one unit alarms, all units will sound. A charge dump feature will quickly discharge the interconnect line when exiting a local alarm. The interconnect input is also digitally filtered. An internal timer allows for single button, push-to-test to be used for a reduced sensitivity mode. An alarm memory feature allows the user to determine if the unit has previously entered a local alarm condition. Utilizing low-power CMOS technology, the RE46C165/6/7/8 was designed for use in smoke detectors that comply with Underwriters Laboratory Specification UL217 and UL268.
2010 Microchip Technology Inc.
DS22251A-page 1
RE46C165/6/7/8
Package Types
RE46C165/6/7/8 PDIP, SOIC C1 C2 DETECT STROBE VDD IRED IO HORNB 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 TEST VSEN VSS ROSC COSC LED FEED HORNS
Functional Block Diagram
VDD (5) R1 276K R2 124K + + IO (7) FEED (10) HS (9) Logic and Timing
VSS (14) VSEN (15)
HB (8) LED (11)
VDD - 3.5V STROBE (4) DETECT (3) C1 (1) C2 (2) TEST (16) Oscillator VDD - 5V Photoamp + Reference Bias and Power Reset
IRED (6)
ROSC (13) COSC (12)
DS22251A-page 2
2010 Microchip Technology Inc.
RE46C165/6/7/8
Typical Application
RADJ1 1.0M R3 8.2k C1 47 nF R2 5k RADJ2 120k R1 4.7k C2 4.7 nF R4 560 D6 R5 Photo Chamber 249k 1 C1 2 C2 3 DETECT 4 STROBE 5 VDD R6 1k C4 100 F D5 R7 22 Q3 6 IRED 7 IO 8 HORNB To Other Units R8 330 C7 10 F LED 11 FEED 10 HORNS 9 C6(3) 1.0 nF R10(3) 1.5M R11(3) 220k TEST 16 VSEN 15 VSS 14 ROSC 13 COSC 12 R13 330 R9 100k D3 C3 (1,2) 1 F 9V Battery R12 10M C5 1.5 nF
Push-to-Test
Note 1: C3 should be located as close as possible to the device power pins. 2: C3 is typical for an alkaline battery. This capacitance should be increased to 4.7 F or greater for a carbon battery. 3: R10, R11 and C6 are typical values and may be adjusted to maximize sound pressure.
2010 Microchip Technology Inc.
DS22251A-page 3
RE46C165/6/7/8
NOTES:
DS22251A-page 4
2010 Microchip Technology Inc.
RE46C165/6/7/8
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDD ...........................................................................12.5V Input Voltage Range Except FEED, I/O .. VIN = -.3V to VDD +.3V FEED Input Voltage Range ............... VINFD =-10 to +22V I/O Input Voltage Range .......................... VIO1= -.3 to 15V Input Current except FEED, TEST, VSEN ...... IIN = 10 mA Input Current for FEED, VSEN....................... IIN = 500 A Operating Temperature ..........................TA = -25 to +75C Storage Temperature.......................TSTG = -55 to +125C Maximum Junction Temperature ................... TJ = +150C
DC ELECTRICAL CHARACTERISTICS
DC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = -25 to +75, VDD = 9V, Typical Application (unless otherwise noted), VSS = 0V Parameter Supply Voltage Supply Current Symbol VDD IDD1 IDD2 IDD3 IDD4 Test Pin 5 5 5 5 5 Min 6 -- -- -- -- Typ -- 4 5.5 -- -- Max 12 6 8 2 3 Units V A A mA mA Conditions Operating COSC = VSS, LED off COSC = VSS, LED off, VDD = 12V COSC = VSS, STROBE on IRED off COSC = VSS, STROBE on, IRED on, Note 1 FEED No local alarm, I/O as an input VSEN TEST FEED No local alarm, I/O as an input VSEN TEST VDD = 12V, COSC = 12V, STROBE active VDD = 12V, VIN = VSS VDD = 12V, VIN = VSS FEED = -10V
Input Voltage High
VIH1 VIH2 VIH3 VIH4
10 7 15 16 10 7 15 16 1, 2, 3 12, 10 15, 16 10
6.2 3.2 1.6 8.5 -- -- -- -- -- -- -- --
4.5 -- -- -- 4.5 -- -- -- -- -- -- --
-- -- -- -- 2.7 1.5 0.5 7 -100 -100 -1 -50
V V V V V V V V nA nA A A
Input Voltage Low
VIL1 VIL2 VIL3 VIL4
Input Leakage Low
IIL1 IIL2 IIL3 ILFD
Note 1: 2: 3:
Does not include Q3 emitter current. Not production tested. Production test at room temperature with guard banded limits.
2010 Microchip Technology Inc.
DS22251A-page 5
RE46C165/6/7/8
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
DC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = -25 to +75, VDD = 9V, Typical Application (unless otherwise noted), VSS = 0V Parameter Input Leakage High Symbol IIH1 IIH2 IHFD Input Pull Down Current IPD1 IPD2 IPDIO1 IPDIO2 Output Off Leakage Low Output Off Leakage High Output High Voltage Output Low Voltage IOZL1 IOZH1 VOH1 VOL1 VOL2 VOL3 Output Current IIOH1 IIODMP Low Battery Voltage Output Voltage VLB VSTOF VSTON VIREDOF VIREDON Test Pin 1, 2 3, 10, 12 10 16 15 7 7 11, 13 11, 13 8, 9 8, 9 13 11 7 7 5 4 4 6 6 Min -- -- -- 0.25 0.1 20 -- -- -- 5.5 -- -- -- -4 5 6.9 VDD -.1 VDD -5.25 -- 2.85 Typ -- -- -- -- 0.25 -- -- -- -- -- -- .5 -- -- -- 7.2 -- VDD -5 -- 3.1 Max 100 100 50 10 0.5 80 140 -1 1 -- 1 -- 0.6 -16 -- 7.5 -- VDD -4.75 0.1 3.35 Units nA nA A A A A A A A V V V V mA mA V V V V V STROBE off, VDD = 12V, IOUT = -1 A STROBE on, VDD = 9V, IOUT = 100 A to 500 A IRED off, VDD = 12V, IOUT = 1 A IRED on, VDD = 9V, IOUT = 0 to -6 mA, TA = +25C Local smoke, Push-to-Test or Chamber Test, Note 2 Internal Reference, Note 2 STROBE output voltage, VDD = 6V to 12V IRED output voltage, VDD = 6V to 12V STROBE output (vs. VDD), VDD = 6V to 12V IRED output voltage, VDD = 6V to 12V Conditions VDD = 12V, VIN = VDD, STROBE active VDD = 12V, VIN = VDD FEED = 22V VIN = VDD VIN = VDD VIN = VDD VIN = 15V, VDD = 12V Outputs off, Output = VSS Outputs off, Output = VDD IOH = -16 mA, VDD = 6.5V IOL = 16 mA, VDD = 6.5V IOL = 5 mA, VDD = 6.5V IOL = 10 mA, VDD = 6.5V Alarm, VIO = VDD - 2V or VIO = 0V At Conclusion of Local Alarm or Test, VIO = 1V
Common Mode Voltage Smoke Comparator Reference Temperature Coefficient
VCM1 VREF TCST TCIRED
1, 2, 3 -- 4 6 4, 5 6, 5
0.5 VDD -3.7 -- -- -- --
-- VDD -3.5 0.01 0.3 -50 -30
VDD-2 VDD -3.3 -- -- -- --
V V %/C %/C dB dB
Line Regulation
VSTON VIREDON
Note 1: 2: 3:
Does not include Q3 emitter current. Not production tested. Production test at room temperature with guard banded limits.
DS22251A-page 6
2010 Microchip Technology Inc.
RE46C165/6/7/8
AC ELECTRICAL CHARACTERISTICS
AC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = -25 to 75, VDD = 9V, Typical Application (unless otherwise noted), VSS = 0V. Parameter Symbol Test Pin 9 9 11 11 11 11 11 11 11 Min Typ Max Units Clocks Conditions
Oscillator Time Base (COSC, ROSC) Oscillator Period Oscillator Tolerance LED Indication (LED) LED On Time LED Period TON1 TPLED0 TPLED1 TPLED2 TPLED3 TPLED4 Alarm Memory LED Pulse Train (3x) Off Time Alarm Memory LED Timer Period STROBE On Time IRED On Time Note 1: 2: 3: 4: TOFLED 9.4 38 450 9.6 225 1.2 10.4 43 500 10.7 250 1.3 11.5 47 550 11.7 275 1.5 ms s s ms s ms s 1 -- 4096 48 1024 24 127 Operating Remote alarm only Standby, no alarm Local alarm condition Timer mode, no local alarm Timer mode, no local alarm Alarm memory set, LED enabled LED IS NOT ON TPOSC TTOLOSC 9.38 -10 10.42 0 11.46 10 ms % 1 1 Operating, Note 1 Operating
TLALED
11
21.5
23.9
26.3
Hours 8257536 Alarm memory set
Detection (STROBE, IRED) TSTON TIRON 4 6 9.4 94 10.4 104 11.5 114 ms s 1 0.01 Smoke test, Chamber test Operating/DIAG, Note 1
TPOSC and TIRON are 100% production tested. All other timing is verified by functional testing. See timing diagram for Horn Temporal Pattern in Figure 3-2. See timing diagram for Horn Continuous Pattern in Figure 3-3. During Timer mode, the LED Period is 10.5 seconds. The LED period will return to 43 seconds at the conclusion of the Timer mode.
2010 Microchip Technology Inc.
DS22251A-page 7
RE46C165/6/7/8
AC ELECTRICAL CHARACTERISTICS (CONTINUED)
AC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = -25 to 75, VDD = 9V, Typical Application (unless otherwise noted), VSS = 0V. Parameter Smoke Test Period IRED and STROBE Symbol TPER0 TPER1 Test Pin 4, 6 4, 6 4, 6 TPER2 4, 6 Min 9.6 1.8 2.4 0.9 Typ 10.7 2.0 2.7 1.0 Max 11.7 2.2 2.9 1.1 Units s s s s Clocks 1024 192 256 96 Conditions Standby, no alarm RE46C165/7 only Standby, 1 valid smoke sample RE46C166/8 only Standby, 1 valid smoke sample RE46C165/7 only Standby, after 2 consecutive valid smoke samples RE46C166/8 only Standby, after 2 consecutive valid smoke samples RE46C165/7 only Local Alarm - (3 consecutive valid smoke samples) RE46C166/8 only Local Alarm - (3 consecutive valid smoke samples) Push button test RE46C165/7 only In remote alarm RE46C166/8 only In remote alarm Chamber test or low battery test, no alarm RE46C165/7 only Local or remote alarm, Note 2 RE46C166/8 only Local or remote alarm, Note 3 RE46C165/7 only Local or remote alarm, Note 2 RE46C166/8 only Local or remote alarm, Note 3 RE46C165/7 only Local or remote alarm, Note 2 RE46C165/7 only Local or remote alarm, Note 2 RE46C166/8 only Local or remote alarm, Note 3 Low battery or fail chamber test, no alarm
4, 6
1.2
1.3
1.5
s
128
TPER3
4, 6
0.9
1.0
1.1
s
96
4, 6
1.2
1.3
1.5
s
128
TPER4 TPER5
4, 6 4, 6 4, 6
300 7.2 9.6 38
333 8.0 10.7 43
367 8.8 11.7 47
ms s s s
32 768 1024 4096
TPER6
4, 6
Horn Operation (HORNB,HORNS,FEED) Alarm On Time THON1 8, 9 8, 9 Alarm Off Time THOF1 8, 9 8, 9 THOF2 Alarm Period THPER1 8, 9 8, 9 8, 9 Low Battery or Chamber Fail Horn On Time Note 1: 2: 3: 4: THON2 8, 9 450 225 450 75 1.35 3.60 0.30 9.4 500 250 500 83 1.50 4.00 0.33 10.4 550 275 550 92 1.65 4.40 0.37 11.5 ms ms ms ms s s s ms 48 24 48 8 144 384 32 1
TPOSC and TIRON are 100% production tested. All other timing is verified by functional testing. See timing diagram for Horn Temporal Pattern in Figure 3-2. See timing diagram for Horn Continuous Pattern in Figure 3-3. During Timer mode, the LED Period is 10.5 seconds. The LED period will return to 43 seconds at the conclusion of the Timer mode.
DS22251A-page 8
2010 Microchip Technology Inc.
RE46C165/6/7/8
AC ELECTRICAL CHARACTERISTICS (CONTINUED)
AC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = -25 to 75, VDD = 9V, Typical Application (unless otherwise noted), VSS = 0V. Parameter Low Battery Horn Off Time Low Battery or Chamber Fail Period Chamber Fail Horn Off Time Chamber Fail Pause Off Time Push-to-Test Alarm Memory Off Time Push-to-Test Alarm Memory Period I/O Active Delay Remote Alarm Delay Symbol THOF3 THPER2 Test Pin 8, 9 8, 9 Min 38 38 Typ 43 43 Max 47 47 Units s s Clocks 4095 4096 Conditions Low battery, no alarm Low battery, no alarm
THOF4 THOF5 THOF6 THPER3
8, 9 8, 9 8, 9 8, 9
291 38 216 225
323 42 240 250
355 46 264 275
ms s ms ms
31 4031 23 24
Failed chamber, no alarm Failed chamber, no alarm Alarm memory active, push-to-test Alarm memory active, push-to-test Local alarm start to I/O active RE46C165/7 only No local alarm, I/O active to alarm RE46C166/8 only No local alarm, I/O active to alarm RE46C165/7 only At conclusion of local alarm or test RE46C166/8 only At conclusion of local alarm or test Maximum I/O pulse width filtered RE46C165/6 only No alarm condition RE46C167/8 only No alarm condition
Interconnect Signal Operation (I/O) TIODLY1 TIODLY2 7 7 0.0 0.74 0.0 0.99 0.0 1.27 s s 0 95
7
0.37
0.57
0.81
s
55
I/O Charge Dump Duration
TIODMP
7
0.89
0.99
1.09
s
95
7
1.19
1.32
1.46
s
127
I/O Filter Hush Timer Operation Hush Timer Period
TIOFILT TTPER
7 -- --
-- 8.1 1.1
-- 9.0 1.2
0.30 9.9 1.4
s Min Min
32 51712 7232
Note 1: 2: 3: 4:
TPOSC and TIRON are 100% production tested. All other timing is verified by functional testing. See timing diagram for Horn Temporal Pattern in Figure 3-2. See timing diagram for Horn Continuous Pattern in Figure 3-3. During Timer mode, the LED Period is 10.5 seconds. The LED period will return to 43 seconds at the conclusion of the Timer mode.
2010 Microchip Technology Inc.
DS22251A-page 9
RE46C165/6/7/8
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 9V, Typical Application (unless otherwise noted), VSS = 0V Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 16L-PDIP Thermal Resistance, 16L-SOIC (150 mil) Thermal Resistance, 16L-SOIC (300 mil) JA JA JA -- -- -- 70 86.1 80 -- -- -- C/W C/W C/W TA TA TSTG -25 -25 -55 -- -- -- +75 +75 +125 C C C Sym Min Typ Max Units Conditions
DS22251A-page 10
2010 Microchip Technology Inc.
RE46C165/6/7/8
2.0 PIN DESCRIPTIONS
PIN FUNCTION TABLE
Symbol C1 C2 DETECT STROBE VDD IRED IO HB HS FEED LED COSC ROSC VSS VSEN TEST High Gain Capacitor Pin Normal Gain Capacitor Pin Photo Diode Input Strobed Detection Negative Supply Positive Power Supply Infrared Emitting Diode Pin Interconnect Pin Horn Brass, Inverted Output Horn Silver Output Horn Feedback Pin LED Driver Pin Oscillator Capacitor Input Oscillator Resistor Drive Low Negative Power Supply Hush Timer Sensitivity Pin Test Pin Function The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
RE46C165/6/7/8 PDIP, SOIC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
2.1
High/Normal Gain Capacitor Pins (C1, C2)
2.4
Positive Power Supply (VDD)
The VDD pin is the device's positive power supply input.
The capacitor connected to the C1 pin sets the photo amplifier gain (high) for the push-to-test and chamber sensitivity test. The size of this capacitor will depend on the chamber background reflections. A = 1 + (C1/10), where C1 is expressed in pF. The gain should be <10000. The capacitor connected to the C2 pin sets the photo amplifier gain (normal) during standby. The value of this capacitor will depend on the smoke sensitivity required. A = 1 + (C2/10), where C2 is expressed in pF.
2.5
Infrared Emitting Diode Pin (IRED)
Provides a regulated pulsed output voltage pre-driver for the infrared emitter. This output usually drives the base of an NPN transistor.
2.6
Interconnect Pin (I/O)
This bidirectional pin provides the capability to interconnect many detectors in a single system. This pin has an internal pull-down device.
2.2
Photo Diode Input (DETECT) 2.7 Horn Brass, Inverted Output (HB)
The HB pin is connected to the metal electrode of a piezoelectric transducer.
This input is normally connected to the cathode of an external photo diode operated at zero bias.
2.3
Strobed Detection Negative Supply (STROBE)
2.8
Horn Silver Output Pin (HS)
Regulated output voltage of VDD - 5, which is active during a test for smoke. This output is the negative side of the photo amplifier reference circuitry.
The HS pin is a complementary output to HB and connects to the ceramic electrode of the piezoelectric transducer.
2010 Microchip Technology Inc.
DS22251A-page 11
RE46C165/6/7/8
2.9 Horn Feedback Pin (FEED)
Usually this pin is connected to the feedback electrode through a current limiting resistor. If not used, this pin must be connected to VDD or VSS. When the horn is enabled, FEED drives the buffered output HS pin and the complementary output HB pin.
2.10
LED Driver Pin (LED)
This pin is an open drain NMOS output used to drive a visible LED.
2.11
Oscillator Capacitor Input (COSC)
A capacitor connected to this pin, with a parallel resistor, sets the internal clock low time, which is approximately the clock period.
2.12
Oscillator Resistor Drive Low (ROSC)
A resistor between this pin and COSC pin sets the internal clock high time. This also sets the IRED pulse width.
2.13
Hush Timer Sensitivity Pin (VSEN)
In Timer mode, this input pin can be used to set an external smoke comparator reference.
2.14
TEST Pin
This input is used to invoke two test modes and the Timer mode. This input has an internal pull-down.
DS22251A-page 12
2010 Microchip Technology Inc.
RE46C165/6/7/8
3.0
3.1
DEVICE DESCRIPTION
Internal Timing
With the external components specified in the Typical Application for ROSC and COSC, the internal oscillator has a nominal period of 10 ms. Normally the analog circuitry is powered down to minimize standby current (typically 4 A at 9V). Once every 10 seconds the detection circuitry (normal gain) is powered up for 10 ms. Prior to completion of the 10 ms period, the IRED pulse is active for 100 s. At the conclusion of the 10 ms period, the photo amplifier is compared to an internal reference to determine the chamber status and latched. If a smoke condition is present, the period to the next detection decreases and additional checks are made. Three consecutive smoke detections will cause the device to go into alarm, and the horn circuit and interconnect will be active. Once every 43 seconds, the status of the battery voltage is checked. This status is checked and latched at the conclusion of the LED pulse. In addition, once every 43 seconds, the chamber is activated and, using the high gain mode (capacitor C1), a check of the chamber is made by amplifying background reflections. If either the low battery or the photo chamber test fails, the horn will chirp for 10 ms every 43 seconds. The oscillator period is determined by the values of R9, R12 and C5 (see the Typical Application figure). The oscillator period is as follows:
After the required three consecutive detections, the device will go into a local alarm condition. When the TEST input is deactivated (VIL4) and after one clock cycle, the normal gain capacitor C2 is selected. The detection rate continues once every 330 ms for the RE46C166/8, and every 250 ms while the horn is not sounding for the RE46C165/7. When three consecutive no smoke conditions are detected, the device returns to standby timing. Push-to-test will not work while the alarm memory is set. The alarm memory notification will be activated instead.
3.4
LED Pulse
In standby, the LED is pulsed on for 10 ms, every 43 seconds. In a local alarm condition or the push-totest alarm, the LED pulse frequency is increased once every.5 seconds. In the case of a remote alarm, the LED is not active. In the Timer mode of operation, the LED is pulsed on for 10 ms every 10 seconds.
3.5
Interconnect
The bidirectional I/O pin allows the interconnection of multiple detectors. In a local alarm condition, this pin is driven high immediately through a constant current source. Shorting this output to ground will not cause excessive current. The I/O is ignored as an input during a local alarm. The I/O pin has a 280k nominal pull-down resistor, so the pin may be left unconnected. The I/O pin also has an NMOS discharge device that is active for 1 second after the conclusion of any type of local alarm. This device helps to quickly discharge any capacitance associated with the interconnect line. If a remote active high signal is detected, the device goes into remote alarm and the horn will be active. Internal protection circuitry allows for the signaling unit to have a higher supply voltage than the signaled unit, without excessive current draw. The interconnect input has a digital filter that ensures filtering out pulses of up to 300 ms. Filter pulses will be ignored and not affect internal timing of the part. This allows for interconnection to other types of alarms (carbon monoxide for example) that may have a pulsed interconnect signal. The remote alarm delay (370 ms to 1.27s) specifies the time from the interconnect going active to sounding the piezo horn alarm.
EQUATION 3-1:
T = TR + TF Where: TR = .693 * R12 * C5 TF = .693 * R9 * C5
3.2
Smoke Detection Circuit
A comparator compares the photo amplifier output to an internal reference voltage. If the required number of consecutive smoke conditions is met, the device will go into local alarm and the horn will be active. In local alarm, the C2 gain is internally increased by approximately 10% to provide alarm hysteresis.
3.3
Push-to-Test Operation
If the TEST input pin is activated (VIH4), the smoke detection is sampled at a high rate. The RE46C166/8 device samples at a period of 330 ms. The RE46C165/7 device has a first sample delay of up to 330 ms. After one sample, the smoke detection rate increases to once every 250 ms. In this mode the high gain capacitor C1 is selected, and background reflections are used to simulate a smoke condition.
2010 Microchip Technology Inc.
DS22251A-page 13
RE46C165/6/7/8
3.6 Low Battery Detection 3.9 Alarm Memory
In standby, an internal reference is compared to the voltage divided VDD supply. A low battery status is latched at the conclusion of the LED pulse. The horn will chirp once for 10 ms every 43 seconds, until the low battery condition no longer exists. The low battery chirp occurs next to the LED pulse. The low battery notification does not sound in a local or remote alarm condition. If a detector has entered a local alarm, when exiting that local alarm, the alarm memory latch is set. Initially the LED can be used to visually identify any unit that had previously been in a local alarm condition. The LED will flash 3 times spaced 1.3 seconds apart. This pattern will repeat every 43 seconds. The duration of the flash is 10 ms. In order to conserve battery power, this visual indication will stop after a period of 24 hours. The user will always be able to identify a unit with an active alarm memory by pressing the push-to-test button. When this button is active, the horn will chirp and the LED will pulse on for 10 ms every 250 ms. The push-to-test alarm will not activate until the alarm memory is reset. If the alarm memory condition is set, any time the pushto-test button is pressed and then released, the alarm memory latch is reset. The initial 24 hour visual indication is not displayed if a low battery condition exits.
3.7
Chamber Fail Detection
In standby, a chamber test is also performed every 43 seconds, by switching to the high gain capacitor C1 and sensing the photo chamber background reflections. Two consecutive chamber test failures will cause the horn to chirp 3 times for 10 ms spaced 323 ms apart. This will repeat every 42 seconds, as long as a chamber test fail exists. The failed chamber test chirps occur ~21 seconds after the LED pulse in Standby mode (not hush). The chamber fail notification does not sound in a local or remote alarm condition.
3.10
Diagnostic Mode
3.8
Timer Mode
If resistors RADJ1 and RADJ2 (see Typical Application figure) are in place and a high-to-low transition occurs on the TEST input, the device enters a timer mode (10 minutes maximum for RE46C165/6 devices, 1 minute maximum for RE46C167/8). In this mode, the smoke comparator reference is switched from the internal VDD - 3.5V reference to the voltage that appears on VSEN. This allows the sensitivity to be modified for the duration of the timer period. High gain operations (push-to-test and chamber test) always use the internal VDD - 3.5V reference. The chamber test is performed in Timer mode. If VSEN is left unconnected or tied to VSS, the Hush Timer mode operation is inhibited. If the smoke level causes the reduced sensitivity set point to be exceeded during this timer period, the unit will go into a local alarm condition, the horn will sound, and the Timer mode is cancelled. If an external only alarm occurs during the Timer mode, the Timer mode is cancelled. If the test button is pushed in a standby, reduced sensitivity mode, the unit is tested normally. Upon release of the test button, the 10 minute maximum timer mode counter is reset and restarted.
In addition to the normal function of the TEST input, a special diagnostic mode is available to calibrate and test the smoke detector. Taking the TEST pin below VSS and sourcing ~200 A out of the pin for 1 clock cycle will enable the diagnostic mode. In the diagnostic mode, some of the pin functions are redefined. Refer to Table 3-1 below for redefined pin functions in the diagnostic mode. In addition, in this mode STROBE is always enabled, and the IRED is pulsed at the clock rate of 10 ms nominal.
DS22251A-page 14
2010 Microchip Technology Inc.
RE46C165/6/7/8
TABLE 3-1:
Pin Name I/O VSEN
DIAGNOSTIC MODE PIN FUNCTION
Pin Number 7 15 Function Disabled as an output. A high on this pin directs the photo amplifier output to pin C1 or C2, determined by the level on VSEN. Amplification occurs during the IRED active time. If I/O is high, then this pin controls the gain capacitor that is used. If VSEN is low, the normal gain is selected and the photo amplifier output appears on C1. If VSEN is high, high gain is selected, and the photo amplifier output is on C2. If VSEN is low, then taking this input high will enable hysteresis, which is a nominal 10% gain increase in normal gain mode. If desired, this pin can be driven by an external clock. This pin becomes the smoke integrator output. A high level indicates that an alarm condition has been detected. The LED pin is used as a low battery indicator. For VDD above the low battery threshold, the open drain NMOS is off. If VDD falls below the threshold, the NMOS turns on.
FEED COSC HORNB LED
10 12 8 11
Standby, No Alarm (not to Scale)
Oscillator TPOSC Internal Clock TST ON STROBE TIRON IRED TPLED1 LED TPER0 TIRON
Low Supply Test Failure
LED STROBE
Low Batt eryWarning Chirp Low Bat t ery Test Low Batt eryTest
THON2 THOF3
Horn THPER2 TPER6
Chamber Fail Test Failure
STROBE
Chamber Fail Test
THON2 Horn
THOF4 THOF5
THPER2 Chamber Test and Warning is Offset from Low Battery Test and Warning by 21.3 Seconds.
FIGURE 3-1:
RE46C165/6/7/8 Timing Diagram - Standby, Low Battery, Chamber Fail.
2010 Microchip Technology Inc.
DS22251A-page 15
RE46C165/6/7/8
Local Alarm Timing
TPER1 TPER2 TPER3
STROBE IRED
TPLED2 TPLED2
LED
Push To Test Alarm Timing
TEST STROBE IRED No Alarm Local Alarm
TIODLY2 T HON1 THOF1 T HOF2 T PER4 TPER4
No Alarm
Horn Patterns
Temporal Horn Continuous Horn
TIODLY2
THON1
THOF1 TIODMP
Interconnect Timing
TIODLY1
IO as output IO as input
TIOFILT TPER5
STROBE No Alarm Notes: 1. Smoke is not sampled when the horn is active. 2. Low battery warning chirp is suppressed in local or remote alarm 3. IO Dump active only in local alarm, inactive if external alarm Remote/External Alarm No Alarm
FIGURE 3-2:
RE46C165/6/7/8 Timing Diagram - Local and Remote Alarm.
DS22251A-page 16
2010 Microchip Technology Inc.
RE46C165/6/7/8
TEST TPLED3 LED Output High Z STROBE TTPER
FIGURE 3-3:
RE46C165/6/7/8 Timing Diagram - Timer Mode.
Alarm Memory
Alarm, No Low Battery
Alarm Memory; No Alarm; No Low Battery
Alarm Memory After 24 Hour Timer
Indication
Standby
LED
TPLED2
TON1
TOFLED TPLED1
TPLED1
TPLED4
TPLED1
THON2 TLALED HB
THPER3
THOF6
TEST
FIGURE 3-4:
RE46C165/7 Timer Diagram - Alarm Memory Mode.
Alarm Memory
Alarm, No Low Battery
Alarm Memory; No Alarm; No Low Battery
Alarm Memory After 24 Hour Timer
Indication
Standby
LED
TPLED2
TON1
TOFLED TPLED1
TPLED1
TPLED4
TPLED1
THON2 TLALED HB
THPER3
THOF6
TEST
FIGURE 3-5:
RE46C166/8 Timer Diagram - Alarm Memory Mode.
2010 Microchip Technology Inc.
DS22251A-page 17
RE46C165/6/7/8
NOTES:
DS22251A-page 18
2010 Microchip Technology Inc.
RE46C165/6/7/8
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
16-Lead PDIP Example
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
e3 RE46C165-V/P^^ 1007256
16-Lead SOIC (150 mil.)
Example
XXXXXXXXXXXXX XXXXXXXXXXXXX YYWWNNN
RE46C165 V/SL e3 1007256
16-Lead SOIC (300 mil.)
Example
XXXXXXXXXXX XXXXXXXXXXX XXXXXXXXXXX YYWWNNN
RE46C165 V/SO e3 1007256
Legend: XX...X Y YY WW NNN
e3
*
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
2010 Microchip Technology Inc.
DS22251A-page 19
RE46C165/6/7/8
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RE46C165/6/7/8
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DS22251A-page 21
RE46C165/6/7/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DS22251A-page 22
2010 Microchip Technology Inc.
RE46C165/6/7/8
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DS22251A-page 23
RE46C165/6/7/8
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DS22251A-page 24
2010 Microchip Technology Inc.
RE46C165/6/7/8
APPENDIX A: REVISION HISTORY
Revision A (May 2010)
* Original Release of this Document.
2010 Microchip Technology Inc.
DS22251A-page 25
RE46C165/6/7/8
NOTES:
DS22251A-page 26
2010 Microchip Technology Inc.
RE46C165/6/7/8
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. /X XX Examples:
a) b) c) d) e) a) b) c) d) e) a) b) c) d) e) a) b) c) d) e) RE46C165E16F: RE46C165S16F: RE46C165S16TF: RE46C165SW16F: RE46C165SW16TF: RE46C166E16F: RE46C166S16F: RE46C166S16TF: RE46C166SW16F: RE46C166SW16TF: RE46C167E16F: RE46C167S16F: RE46C167S16TF: RE46C167SW16F: RE46C167SW16TF: RE46C168E16F: RE46C168S16F: RE46C168S16TF: RE46C168SW16F: RE46C168SW16TF: 16LD PDIP Package 16LD SOIC Package 16LD SOIC Package, Tape and Reel 16LD SOIC Package 16LD SOIC Package, Tape and Reel 16LD PDIP Package 16LD SOIC Package 16LD SOIC Package, Tape and Reel 16LD SOIC Package 16LD SOIC Package, Tape and Reel 16LD PDIP Package 16LD SOIC Package 16LD SOIC Package, Tape and Reel 16LD SOIC Package 16LD SOIC Package, Tape and Reel 16LD PDIP Package 16LD SOIC Package 16LD SOIC Package, Tape and Reel 16LD SOIC Package 16LD SOIC Package, Tape and Reel
Device Package Number of Pins
Device
RE46C165: RE46C165T:
CMOS Photoelectric Smoke Detector ASIC CMOS Photoelectric Smoke Detector ASIC (Tape and Reel, SOIC only) RE46C165/7: CMOS Photoelectric Smoke Detector ASIC RE46C165/7T: CMOS Photoelectric Smoke Detector ASIC (Tape and Reel, SOIC only) RE46C166/8: CMOS Photoelectric Smoke Detector ASIC RE46C166/8T: CMOS Photoelectric Smoke Detector ASIC (Tape and Reel, SOIC only) RE46C165/6: CMOS Photoelectric Smoke Detector ASIC RE46C165/6T: CMOS Photoelectric Smoke Detector ASIC (Tape and Reel, SOIC only) = = = Plastic Dual In-Line, 300 mil. Body, 16-Lead (PDIP) Small Plastic Outline - Narrow, 3.90 mm Body, 16-Lead (SOIC) Small Plastic Outline - Wide, 7.50 mm Body, 16-Lead (SOIC)
Package
E S SW
2010 Microchip Technology Inc.
DS22251A-page 27
RE46C165/6/7/8
NOTES:
DS22251A-page 28
2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-170-3
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
2010 Microchip Technology Inc.
DS22251A-page 29
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
01/05/10
DS22251A-page 30
2010 Microchip Technology Inc.

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